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If I can fix that inner layer trace, than I may proceed with that strategy (I beliieve to be my only choice other than to abandon the upgrade alltogether). Of course, the salvation of the empeg relies on finding where that broken inner trace needs to be shorted.


I used to design the conveyor machines that replaced thru-hole plating for innerlayer connection. The stuff the conveyor machines uses is, essentially, carbon powder and corn starch. It forms a very low resistance resistor between layers.

Two products I know of that do this are called "shadow" and "black hole".

It might be worth a look.